The MCW30 comes pre-configured for AMD compatible motherboards and is shown here with the Asus AN8-SLI Deluxe. Removal of the motherboard from the chassis is necessary for installation.
The wire-clips for installation with Intel chipsets are included with the fastening hardware. Removal of the motherboard from the chassis is not necessary for installation of the MCW30 in this type of motherboards.
Exceptional quality and attention to details: the copper base is lapped to 0.0003" (3/10 of 1/1000"), and polished to near-mirror finish to promote optimum thermal conductivity. Users are advised that while flatness is strictly respected for providing the most significant benefit to thermal interface, surface polish is a cosmetic component and may vary slightly from one water-block to another. Re-lapping or polishing the copper base is never recommended.
Pressure Drop Curves General Specifications
Pressure Drop Curves
General Specifications
Range of mounting holes
Fittings compatibility note:
G ¼, or BSPP, fittings will fit, but may not seal; each must be checked prior to assuming that it will not leak just because they fit together.
Both NPSM and G ¼ (BSPP) are parallel thread and nominally the same size, the principal difference being 18 threads per inch for NPSM and 19 threads per inch for G ¼ (BSPP). Since most male end G ¼ fittings have a short thread length they can generally be engaged in the NPSM threads without difficulty.
The joint seal is effected with an o-ring which for the NPSM barb is in a groove on the water-block top and compressed by the flange nut barb. G ¼ fittings have the o-ring captured in a groove under the fitting nut. G ¼ fittings will seal so long as there is a straight portion under the nut flats sufficient to bring the G ¼ fitting’s o-ring into contact with the bottom of the o-ring groove, a depth of 0.080”.