IC Diamond 7 Carat Thermal Compound maximizes
thermal heat transfer between the CPU core and heatsink by taking advantage of
diamond’s superior thermal conductivity. Purified synthetic diamond has a
thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure
silver. Diamond’s are five times better thermal conductors compared to silver
which makes it a superior heat transfer material for cooling high performance
CPUs and is electrically non-conductive and non-capacitive.
IC Diamond contains a solvent which enhances application to the CPU. For optimum
results, after applying a thin coat of IC Diamond on the CPU, DO NOT install the
heatsink for 10 minutes to allow solvent to evaporate.
IC Diamond is composed mostly of diamond powder,
and as such is quite thick. Proper application is critical to optimum
performance. Squeeze onto the center of the CPU an amount of IC Diamond compound
about the size of a pea - the center of the CPU is where most heat is
concentrated. Place the heatsink on the CPU and push down to spread IC Diamond
over the CPU's surface. Clamp the heatsink and power up the PC.
IC Diamond requires minimal time to attain peak performance; in most cases, IC
Diamond will reach peak performance after two hours of use.
IC Diamond is designed for stability – it will not bleed or separate in normal
Thermal Conductance: 4.5 W/m-K (data acquired with an ASTM D – 5470 thermal
interface test instrument)
Thermal Resistance: 0.25oC-cm2/W@ 100 ì BLT
Average Particle Size: <40 ì maximum particle diameter
Compliancy: RoHS Compliant.