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Swiftech MCW82 Universal GPU waterblock

Swiftech Heatsink ATI Radeon HD6970 Series Reference Design

Swiftech Heatsink ATI Radeon HD6970 Series Reference Design

Swiftech Heatsink ATI Radeon HD6970 Series Reference Design

SKU
HD6970-HS-D

The HD6970 heatsink is designed to cool surface mount components (memory, and mosfets) on the most recent revision of ATI Radeon™ HD 6970 2Gb Series Reference Design boards, as well as (1) HD 6950 2Gb Series reference design graphics board. Compatible Brand Models and PCB versions are listed hereafter.

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The HD6970 heatsink is designed to cool surface mount components (memory, and mosfets) on the most recent revision of ATI Radeon™ HD 6970 2Gb Series Reference Design boards, as well as (1) HD 6950 2Gb Series reference design graphics board. Compatible Brand Models and PCB versions are listed hereafter. 
 
The Heatsink is designed to be installed in conjunction with our MCW60, MCW80 and MCW82 VGA waterblocks and to allow stable overclocks of these high-end graphic cards while keeping them cool and silent or very quiet. For high-overclock applications where maximum voltage is added to the card, an optional slow speed (quiet) 80mm fan can be added to complement cooling of the power MOSFETS, resulting in up to 30% drop in these components temperature compared to stock cooling.
 
The performance advantage of  hybrid cooling which consists in cooling the GPU with a universal waterblock in combination with a heatsink compared to using a full-cover water-block solutions is well known among enthusiast users: improved thermal dissipation at the GPU level thanks to Swiftech's Diamond Pin Matrix and a better TIM joint, and less heat dumped into the liquid cooling loop coming from memory, and power MOSFETS since they remain air cooled. In addition, this combination provides a complete solution that is more economical than full-cover waterblocks because the GPU waterblock can be re-used over time with different VGA cards.
 
The heatsink is a custom Aluminum extrusions, and it is precision CNC machined to allow optimum TIM joints with the hottest components such as the voltage regulator modules, where high performance thermal grease is to be used. Less heat intensive components such as memory receive pre-applied thermal pads, as shown below.
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