Constructed from copper for optimal heat transfer and sporting vapor chamber technology, the R15 supports a CPU with maximum TDP rating of 150W. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required.The R15 passive heatsink is designed to be used in conjunction with an active cooling system; the 1U case must have active cooling, e.g., fans.
Passive 1U rackmount CPU cooler from Dynatron® for Intel® LGA 2011 (Socket R) Sandy Bridge server processors.
Constructed from copper for optimal heat transfer and sporting vapor chamber technology, the R15 supports a CPU with maximum TDP rating of 150W. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required.The R15 passive heatsink is designed to be used in conjunction with an active cooling system; the 1U case must have active cooling, e.g., fans.
What is a Vapor Chamber and how does that help me? A vapor chamber is, in essence, a flattened heatpipe in direct contact to the CPU surface that transfers and dissipates heat more efficientlythan a traditional heatsink can manage. The vapor chamber is air tight, containing a coolant, and operates through a continuous cycle of evaporative cooling. What this provides you with is more effective cooling and CPU thermal protection with no additional bulk.
https://www.performance-pcs.com/dynatron-r15-intel-socket-2011-1u-vapor-chamber-heatsink-r15.html9387Dynatron R15 Intel Socket 2011 1U Vapor Chamber Heatsink https://www.performance-pcs.com/media/catalog/product/t/m/tmpr15_01.jpg36.7448.9900USDInStock/Clearance/Scratch&Dent/Heatsinks Clearance/Air Cooling/CPU Heatsinks<p>Constructed from copper for optimal heat transfer and sporting vapor chamber technology, the R15 supports a CPU with maximum TDP rating of 150W. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required.The R15 passive heatsink is designed to be used in conjunction with an active cooling system; the 1U case must have active cooling, e.g., fans.</p> <p style="font-family: tahoma,arial,helvetica,sans-serif;"><span style="font-size: small;" size="2">Passive 1U rackmount CPU cooler from Dynatron® for Intel® LGA 2011 (Socket R) Sandy Bridge server processors. <br /></span></p>
<p style="font-family: tahoma,arial,helvetica,sans-serif;"><span style="font-size: small;" size="2">Constructed from copper for optimal heat transfer and sporting vapor chamber technology, the R15 supports a CPU with maximum TDP rating of 150W. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required.The R15 passive heatsink is designed to be used in conjunction with an active cooling system; the 1U case must have active cooling, e.g., fans. <br /></span></p>
<p style="font-family: tahoma,arial,helvetica,sans-serif;"><span style="font-size: small;" size="2">What is a Vapor Chamber and how does that help me? A vapor chamber is, in essence, a flattened heatpipe in direct contact to the CPU surface that transfers and dissipates heat more efficientlythan a traditional heatsink can manage. The vapor chamber is air tight, containing a coolant, and operates through a continuous cycle of evaporative cooling. What this provides you with is more effective cooling and CPU thermal protection with no additional bulk.</span></p>Dynatron00https://www.performance-pcs.com/media/catalog/product/t/m/tmpr15_02.jpghttps://www.performance-pcs.com/media/catalog/product/t/m/tmpr15_03.jpghttps://www.performance-pcs.com/media/catalog/product/t/m/tmpr15_04.jpg35.1500add-to-cartDynatronIntel LGA 2011&(-3)/2066Copper<ul style="font-family: tahoma,arial,helvetica,sans-serif;">
<li><span style="font-size: small;" size="2">Solid copper heatsink with stacked-fins</span></li>
<li><span style="font-size: small;" size="2">CPU Support: LGA 2011 (Socket R), Sandy Bridge - EP/EX, Intel® CoreTM i7, Xeon® E5 and other LGA 2011 processors, 150W TDP MAX</span></li>
<li><span style="font-size: small;" size="2">Supports 1U+</span></li>
<li><span style="font-size: small;" size="2">Shin-Etsu G751 Thermal Compound (pre-printed)</span></li>
<li><span style="font-size: small;" size="2">Dimensions: 90 x 90 x 27mm, 3.54" x 3.54" x 1.06" (in inches)</span></li>
<li><span style="font-size: small;" size="2">RoHS Compliance</span></li>
</ul><table style="font-family: tahoma,arial,helvetica,sans-serif; width: 440px;" class=" FCK__ShowTableBorders" border="0" cellspacing="1">
<tbody>
<tr>
<td width="100"><span style="font-size: small;" size="2">CPU Socket</span></td>
<td width="340"><span style="font-size: small;" size="2">2011</span></td>
</tr>
<tr>
<td colspan="2" width="100"><span style="font-size: small;" size="2"><img src="/pub/media/descriptions/33229-line_gray.jpg" border="0" height="1" width="436" /></span></td>
</tr>
<tr>
<td width="100"><span style="font-size: small;" size="2">CPU Support</span></td>
<td width="340"><span style="font-size: small;" size="2">Intel® Sandy Bridge EP/EX Processors</span></td>
</tr>
<tr>
<td colspan="2" width="100"><span style="font-size: small;" size="2"><img src="/pub/media/descriptions/33229-line_gray.jpg" border="0" height="1" width="436" /></span></td>
</tr>
<tr>
<td width="100"><span style="font-size: small;" size="2">Solution</span></td>
<td width="340"><span style="font-size: small;" size="2">1U Server</span></td>
</tr>
<tr>
<td colspan="2" width="100"><span style="font-size: small;" size="2"><img src="/pub/media/descriptions/33229-line_gray.jpg" border="0" height="1" width="436" /></span></td>
</tr>
<tr>
<td height="16" width="100"><span style="font-size: small;" size="2">Overall Dimension</span></td>
<td height="16" width="340"><span style="font-size: small;" size="2">90.0 x 90.0 x 27.0 mm</span></td>
</tr>
<tr>
<td colspan="2" width="100"><span style="font-size: small;" size="2"><img src="/pub/media/descriptions/33229-line_gray.jpg" border="0" height="1" width="436" /></span></td>
</tr>
<tr>
<td width="100"><span style="font-size: small;" size="2">Weight</span></td>
<td width="340"><span style="font-size: small;" size="2">435 g</span></td>
</tr>
<tr>
<td colspan="2" width="100"><span style="font-size: small;" size="2"><img src="/pub/media/descriptions/33229-line_gray.jpg" border="0" height="1" width="436" /></span></td>
</tr>
<tr>
<td height="16" width="100"><span style="font-size: small;" size="2">Material</span></td>
<td height="16" width="340"><span style="font-size: small;" size="2">Vapor chamber base with Copper stacked fin </span></td>
</tr>
<tr>
<td colspan="2" width="100"><span style="font-size: small;" size="2"><img src="/pub/media/descriptions/33229-line_gray.jpg" border="0" height="1" width="436" /></span></td>
</tr>
<tr>
<td width="100"><span style="font-size: small;" size="2">Thermal Resistance VS. Cooling Fan Speed</span></td>
<td width="340"><span style="font-size: small;" size="2"><img src="/pub/media/descriptions/33229-R15_Thermal_Resistance_RPM_Chart.jpg" border="0" height="182" width="337" /></span></td>
</tr>
<tr>
<td colspan="2" width="100"><span style="font-size: small;" size="2"><img src="/pub/media/descriptions/33229-line_gray.jpg" border="0" height="1" width="436" /></span></td>
</tr>
<tr>
<td width="100"><span style="font-size: small;" size="2">Note</span></td>
<td width="340"><span style="font-size: small; color: #ff0000;" size="2" color="#ff0000">1. Support CPU Power up to 150 Watts <br />2. Thermal Grease Pre-Printed with Shin-Etsu G751<br />3. RoHS Compliance<br />4. Backplate is not included.</span></td>
</tr>
</tbody>
</table>
Low Stock 2 left
Download PDF 
