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Kingpin Cooling KPx High Performance Thermal Compound 30G

Kingpin Cooling KPx High Performance Thermal Compound 30G

Indigo Xtreme™ for Intel™ Skylake-X & Broadwell-E CPUs

Indigo Xtreme™ for Intel™ Skylake-X & Broadwell-E CPUs

Indigo Xtreme™ for Intel™ Skylake-X & Broadwell-E CPUs

SKU
SKYLAKEX-X1

Optimized for use with water blocks and AIO water coolers, the new Indigo Xtreme for Intel™ Skylake-X & Broadwell-E CPUs can be installed without any operating system or special utilities (such as SpeedFan™/Prime95), making it ideal for new builds. This model also features a wider metal alloy heat path and thin interfacial bondline for maximum thermal performance.

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Optimized for use with water blocks and AIO water coolers, the new Indigo Xtreme for Intel™ Skylake-X & Broadwell-E CPUs can be installed without any operating system or special utilities (such as SpeedFan™/Prime95), making it ideal for new builds. This model also features a wider metal alloy heat path and thin interfacial bondline for maximum thermal performance.

The Indigo Xtreme thermal interface kit for Skylake-X & Broadwell-E includes several cleanroom-grade cleaning products and two complete installations.

Metallic Thermal Interface Solution

Supporting Intel Skylake-X Socket 2066 (7800X, 7820X, 7900X, 7920X, 7940X, 7960X, 7980XE) & Broadwell-E Socket 2011-3 (6800K, 6850K, 6900K, 6950X) Processors

 ** Please see the Cooler Compatibility Application Note at www.indigo-xtreme.com to determine compatibility with your specific water block or cooler.  Large air coolers will require operating system and special utilities (such as SpeedFan™/Prime95) **

The Indigo Xtreme innovative and patented structure deploys a highly conductive Phase Change Metal Alloy (PCMA) into all the surface micro-asperities on your CPU lid and heat sink, resulting in the lowest resistance heat path of any grease, paste, or pad thermal interface product available today.

High Thermal Performance
• Bulk thermal conductivity >20 W/mK
• Lower overall thermal resistance than any grease, paste, or pad TIM
• No cure time

High Reliability
• Fully sealed structure - no mess or migration
• Most consistent performance - applies the correct amount of alloy every time
• Gallium-free
• Laser-cut precision

User Friendly
• Fully compatible with copper and aluminum surfaces
• Peel-and-stick application
• Easy clean up - just peel to remove

Proven

As confirmed by independent tests, the Indigo family of engineered thermal interfaces are the highest performing TIMs available.

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