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Fluid XP+ Nano-Fluid Liquid Cooling Fluid 32 oz. - Neon Green (UV)
Fluid XP+ Nano Liquid Cooling Fluid 32 oz. - Neon Green (UV)

Special Price: $4.95

Regular Price: $44.99

You save: $40.04
Corsair Vengeance® C70 Mid-Tower Gaming Case — Gunmetal Black
Corsair Vengeance® C70 Mid-Tower Gaming Case — Gunmetal Black

Special Price: $89.99

Regular Price: $139.99

You save: $50.00
*** NEW *** Swiftech Maelstrom 5 1/4
Swiftech Maelstrom 5 1/4" Dual-Bay Reservoir - Dual Pump Housing

Special Price: $49.95

Regular Price: $139.95

You save: $90.00
Watercool HEATKILLER® GPU-X³ R9 290X Ni
Watercool HEATKILLER® GPU-X³ R9 290X Ni

Special Price: $89.95

Regular Price: $141.95

You save: $52.00


Thermal Interface Materials

Performance-PCs carries all the thermal compounds, pads, epoxies, and cleaning accessories you need for your CPU waterblocks, heatsinks and coolers, from manufacturers like Arctic, Prolimatech, FujiPoly, CoolerMaster, Indigo Extreme, Arctic Silver, and many more

Our Best Selling Products

Introducing Arctic Alumina Thermal Compound The first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions.

$4.95

Shin Etsu - the industry standard in high performance thermal interface material. Non-conductive heat transfer CPU thermal grease for maximum performance. This CPU thermal grease's package allows for easy application to most CPU cooler and heat sink. It is used to increase surface contact area for heat transfer by minimizing any air bubbles that exists between the top of the processor and the base of the heat sink. Note that 1 gm is the weight measurement and the syringe packaging shows cc measurement, which does not correspond.

$3.95

Shin-Etsu X23 Thermal Compound (Model X23-7783D) - This thermal interface compound is developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. Shin-Etsu MicroSi's X23-7783D product offering utilizes fillers that have a controlled diameter. The smaller diameter filler allows the material to achieve thinner bondlines. For best results, this material should be used in applications where the hills and valleys of the mating surfaces are minimal.

$3.95

Shin-Etsu X23-7762 Thermal Compound (Model X23-7762) - This thermal interface compound is developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. It is used to increase surface contact area for heat transfer by minimizing any air bubbles that exists between the top of the processor and the base of the heat sink.

$4.99

3M's highest mechanical strength thermally conductive tapes, also offers improved surface wetout and excellent shock performance! This is the same high quality tape used by Swiftech and Enzotech and other major companies for adhesion of ram sinks, mosfets and other heatsinks used in air and water cooling of computer hardware.

$2.95

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