NEW! Update 5-10-07: The MC14 now receives an upgraded sticky pad with considerably enhanced adhesion.
The MC14 is a BGA memory Ramsink made of forged copper and optimized for convection cooling. It was designed for cooling of memory components such as those found in graphic cards, but it works equally well with motherboard VRM modules , compositing chips, or any SMC in need of superior cooling.
It is a perfect companion to our VGA liquid cooling solutions thus allowing high-end graphic cards to operate in virtual silence.
Features:
The MC14 is made of forged copper. The density of the pins has been calculated to offer maximum surface area to increase heat dissipation, while allowing the heated air to circulate freely between the pins.
High quality thermal pads: the high quality Thermattach™ T411 thermal tape offers excellent thermal conductivity and adhesion to the memory modules.
Quick, safe and easy installation: simply peel-off the protective paper, and press the Ramsink onto the component to be cooled.
Maximum recommended heat load: 5 Watts per heatsink
We conducted laboratory tests, comparing the MC14 to generic skived copper units such as shown below, and found a 6°C improvement in component temperature at a 5 Watts heat load.
Test conditions: 5 W heat load 25°C ambient
Junction Temperature
76.8°C
70.3°C
For reference, maximum junction (core) temperature in current GDDR3 memory modules is 125°C (link)
Installation
Remove the existing heatsink
Carefully clean the surface of the memory modules with a degreaser (Xylene for example)
follow the easy installation steps below
Handle the heatsinks with care when they have just been installed onto the memory. Heat developed by the memory in operations will strengthen the bond of the thermal adhesive.
NEW! Update 5-10-07: The MC14 now receives an upgraded sticky pad with considerably enhanced adhesion.
The MC14 is a BGA memory Ramsink made of forged copper and optimized for convection cooling. It was designed for cooling of memory components such as those found in graphic cards, but it works equally well with motherboard VRM modules , compositing chips, or any SMC in need of superior cooling.
It is a perfect companion to our VGA liquid cooling solutions thus allowing high-end graphic cards to operate in virtual silence.
Features:
The MC14 is made of forged copper. The density of the pins has been calculated to offer maximum surface area to increase heat dissipation, while allowing the heated air to circulate freely between the pins.
High quality thermal pads: the high quality Thermattach™ T411 thermal tape offers excellent thermal conductivity and adhesion to the memory modules.
Quick, safe and easy installation: simply peel-off the protective paper, and press the Ramsink onto the component to be cooled.
Maximum recommended heat load: 5 Watts per heatsink
We conducted laboratory tests, comparing the MC14 to generic skived copper units such as shown below, and found a 6°C improvement in component temperature at a 5 Watts heat load.
Test conditions: 5 W heat load 25°C ambient
Junction Temperature
76.8°C
70.3°C
For reference, maximum junction (core) temperature in current GDDR3 memory modules is 125°C (link)
Installation
Remove the existing heatsink
Carefully clean the surface of the memory modules with a degreaser (Xylene for example)
follow the easy installation steps below
Handle the heatsinks with care when they have just been installed onto the memory. Heat developed by the memory in operations will strengthen the bond of the thermal adhesive.
https://www.performance-pcs.com/swiftech-mc14-vga-forged-copper-bga-ramsinks-mc14.html3121Swiftech MC14 VGA Forged Copper BGA Ramsinkshttps://www.performance-pcs.com/media/catalog/product/t/m/tmpmc14_01.jpg16.9519.9500USDOutOfStock/Air Cooling/Video Card Coolers<h3><font face="Tahoma">Product Details:</font></h3>
<table width="670" class="content" id="table6"><tbody><tr><td><p align="left"><font size="2" face="Tahoma"><strong>NEW! Update 5-10-07:<br />The MC14 now receives an upgraded sticky pad with considerably enhanced adhesion. </strong></font></p><p align="left"><font size="2" face="Tahoma">The MC14 is a BGA memory Ramsink made of forged copper and optimized for convection cooling. It was designed for cooling of memory components such as those found in graphic cards, but it works equally well with motherboard VRM modules , compositing chips, or any SMC in need of superior cooling. <br /><br />It is a perfect companion to our VGA liquid cooling solutions thus allowing high-end graphic cards to operate in virtual silence.</font></p><h1 align="left"><font size="2" face="Tahoma">Features:</font></h1><ul><li><font size="2" face="Tahoma">The MC14 is made of forged copper. The density of the pins has been calculated to offer maximum surface area to increase heat dissipation, while allowing the heated air to circulate freely between the pins. </font></li></ul><p align="center"><img height="251" width="200" alt="mc-14" src="/media/descriptions/3811-a_swiftech_mc14_ram_sink_lg.gif" /></p><ul><li><font size="2" face="Tahoma"><b>High quality thermal pads: <span class="content">the high quality Thermattach™ T411 thermal tape offers excellent thermal conductivity</span></b> and adhesion to the memory modules. </font></li><li><font size="2" face="Tahoma"><span class="content">Quick, safe and easy installation: simply peel-off the protective paper, and press the Ramsink onto the component to be cooled.</span></font></li><li><font size="2" face="Tahoma">Ideal companion to the MCW55 GPU water-block.</font></li><li><font size="2" face="Tahoma">Sold in convenient pack of 8 pieces.</font></li></ul></td></tr><tr><td height="1065"><h1><font size="2" face="Tahoma"><a name="5">Performance and Specifications:</a></font></h1><ul><li><font size="2" face="Tahoma">Forged C110 copper </font></li><li><font size="2" face="Tahoma">14mm (L) x 14mm (W) x 14.5mm (H) </font></li><li><font size="2" face="Tahoma">Weight: 0.3 oz (8.5 g) </font></li><li><font size="2" face="Tahoma">C/W: 9.0 (including TIM joint) </font></li><li><font size="2" face="Tahoma">Maximum recommended heat load: 5 Watts per heatsink </font></li></ul><p><font size="2" face="Tahoma">We conducted laboratory tests, comparing the MC14 to generic skived copper units such as shown below, and found a 6°C improvement in component temperature at a 5 Watts heat load.</font></p>
<table style="width: 500px; border-collapse: collapse;"><tbody><tr>
<td style="border: 1px solid rgb(0, 0, 0);">Test conditions: 5 W heat load 25°C ambient
</td>
<td style="border: 1px solid rgb(0, 0, 0); text-align: justify;">
<img border="0" align="middle" src="/media/descriptions/3811-OCZ.gif" alt="OCZ" style="margin: 5px;" /><br />
</td>
<td style="border: 1px solid rgb(0, 0, 0); text-align: justify;">
<img border="0" align="middle" src="/media/descriptions/3811-MC14-1X100.gif" alt="MC14x1" style="margin: 5px;" /><br />
</td>
</tr>
<tr>
<td style="border: 1px solid rgb(0, 0, 0);">Junction Temperature
</td>
<td style="border: 1px solid rgb(0, 0, 0);">76.8°C
</td>
<td style="border: 1px solid rgb(0, 0, 0);">70.3°C
</td></tr></tbody></table><p><font size="2" face="Tahoma">For reference, maximum junction (core) temperature in current GDDR3 memory modules is 125°C (<a href="http://www.infineon.com/upload/Document/HYB18H512321AF_Rev1.73_2005-08-18.pdf" target="_blank">link</a>)</font></p><h1><font size="2" face="Tahoma">Installation</font></h1><ol><li><font size="2" face="Tahoma">Remove the existing heatsink </font></li><li><font size="2" face="Tahoma">Carefully clean the surface of the memory modules with a degreaser (Xylene for example) </font></li><li><font size="2" face="Tahoma">follow the easy installation steps below </font></li><li><font size="2" face="Tahoma">Handle the heatsinks with care when they have just been installed onto the memory. Heat developed by the memory in operations will strengthen the bond of the thermal adhesive. </font></li></ol><table width="400" cellspacing="0" cellpadding="0" border="1" id="table8"><tbody><tr class="content"><td><div align="center"><img height="200" width="135" alt="heatsink" src="/media/descriptions/3811-a_mc14_step_1.gif" /><br /><font size="2" face="Tahoma">Step 1</font></div></td><td><div align="center"><img height="200" width="132" alt="heatsink" src="/media/descriptions/3811-a_mc14_step_2.gif" /><br /><font size="2" face="Tahoma">Step 2</font></div></td></tr><tr><td colspan="2"><div align="center"><p class="content"><img height="300" width="412" alt="heatsinks" src="/media/descriptions/3811-a_mc14_instaled_view_step_3.gif" /><br /><font size="2" face="Tahoma">Installation complete</font></p></div></td></tr></tbody></table></td></tr></tbody></table> <h3><font face="Tahoma">Product Details:</font></h3>
<table width="670" class="content" id="table6"><tbody><tr><td><p align="left"><font size="2" face="Tahoma"><strong>NEW! Update 5-10-07:<br />The MC14 now receives an upgraded sticky pad with considerably enhanced adhesion. </strong></font></p><p align="left"><font size="2" face="Tahoma">The MC14 is a BGA memory Ramsink made of forged copper and optimized for convection cooling. It was designed for cooling of memory components such as those found in graphic cards, but it works equally well with motherboard VRM modules , compositing chips, or any SMC in need of superior cooling. <br /><br />It is a perfect companion to our VGA liquid cooling solutions thus allowing high-end graphic cards to operate in virtual silence.</font></p><h1 align="left"><font size="2" face="Tahoma">Features:</font></h1><ul><li><font size="2" face="Tahoma">The MC14 is made of forged copper. The density of the pins has been calculated to offer maximum surface area to increase heat dissipation, while allowing the heated air to circulate freely between the pins. </font></li></ul><p align="center"><img height="251" width="200" alt="mc-14" src="/media/descriptions/3811-a_swiftech_mc14_ram_sink_lg.gif" /></p><ul><li><font size="2" face="Tahoma"><b>High quality thermal pads: <span class="content">the high quality Thermattach™ T411 thermal tape offers excellent thermal conductivity</span></b> and adhesion to the memory modules. </font></li><li><font size="2" face="Tahoma"><span class="content">Quick, safe and easy installation: simply peel-off the protective paper, and press the Ramsink onto the component to be cooled.</span></font></li><li><font size="2" face="Tahoma">Ideal companion to the MCW55 GPU water-block.</font></li><li><font size="2" face="Tahoma">Sold in convenient pack of 8 pieces.</font></li></ul></td></tr><tr><td height="1065"><h1><font size="2" face="Tahoma"><a name="5">Performance and Specifications:</a></font></h1><ul><li><font size="2" face="Tahoma">Forged C110 copper </font></li><li><font size="2" face="Tahoma">14mm (L) x 14mm (W) x 14.5mm (H) </font></li><li><font size="2" face="Tahoma">Weight: 0.3 oz (8.5 g) </font></li><li><font size="2" face="Tahoma">C/W: 9.0 (including TIM joint) </font></li><li><font size="2" face="Tahoma">Maximum recommended heat load: 5 Watts per heatsink </font></li></ul><p><font size="2" face="Tahoma">We conducted laboratory tests, comparing the MC14 to generic skived copper units such as shown below, and found a 6°C improvement in component temperature at a 5 Watts heat load.</font></p>
<table style="width: 500px; border-collapse: collapse;"><tbody><tr>
<td style="border: 1px solid rgb(0, 0, 0);">Test conditions: 5 W heat load 25°C ambient
</td>
<td style="border: 1px solid rgb(0, 0, 0); text-align: justify;">
<img border="0" align="middle" src="/media/descriptions/3811-OCZ.gif" alt="OCZ" style="margin: 5px;" /><br />
</td>
<td style="border: 1px solid rgb(0, 0, 0); text-align: justify;">
<img border="0" align="middle" src="/media/descriptions/3811-MC14-1X100.gif" alt="MC14x1" style="margin: 5px;" /><br />
</td>
</tr>
<tr>
<td style="border: 1px solid rgb(0, 0, 0);">Junction Temperature
</td>
<td style="border: 1px solid rgb(0, 0, 0);">76.8°C
</td>
<td style="border: 1px solid rgb(0, 0, 0);">70.3°C
</td></tr></tbody></table><p><font size="2" face="Tahoma">For reference, maximum junction (core) temperature in current GDDR3 memory modules is 125°C (<a href="http://www.infineon.com/upload/Document/HYB18H512321AF_Rev1.73_2005-08-18.pdf" target="_blank">link</a>)</font></p><h1><font size="2" face="Tahoma">Installation</font></h1><ol><li><font size="2" face="Tahoma">Remove the existing heatsink </font></li><li><font size="2" face="Tahoma">Carefully clean the surface of the memory modules with a degreaser (Xylene for example) </font></li><li><font size="2" face="Tahoma">follow the easy installation steps below </font></li><li><font size="2" face="Tahoma">Handle the heatsinks with care when they have just been installed onto the memory. Heat developed by the memory in operations will strengthen the bond of the thermal adhesive. </font></li></ol><table width="400" cellspacing="0" cellpadding="0" border="1" id="table8"><tbody><tr class="content"><td><div align="center"><img height="200" width="135" alt="heatsink" src="/media/descriptions/3811-a_mc14_step_1.gif" /><br /><font size="2" face="Tahoma">Step 1</font></div></td><td><div align="center"><img height="200" width="132" alt="heatsink" src="/media/descriptions/3811-a_mc14_step_2.gif" /><br /><font size="2" face="Tahoma">Step 2</font></div></td></tr><tr><td colspan="2"><div align="center"><p class="content"><img height="300" width="412" alt="heatsinks" src="/media/descriptions/3811-a_mc14_instaled_view_step_3.gif" /><br /><font size="2" face="Tahoma">Installation complete</font></p></div></td></tr></tbody></table></td></tr></tbody></table>Swiftech0011.0100add-to-cartlow-stockSwiftechCopperCopper
No Stock
Download PDF 
