Dynatron K17 3U CPU Cooler Heatpipes, Intel LGA 1155 / 1156, i7, Xeon, Socket H2

Active 3U CPU cooler from Dynatron® for Intel® LGA 1155 / 1156 (Socket H2, H) server processors. The K17 3U CPU cooler is comprised of multiple design elements. The alumium heatsink provides optimal heat transfer and dissipation and is aligned (fin direction parallel to airflow) to the 92mm fan on its side. 4 copper heatpipes, with direct contact to the CPU, are employed to enhance heat transfer away from the CPU. The heatpipes are split up both sides of the heatsink to maximize travel and efficiency. Using this design, the K17 is able to provide cooling for processors with a maximum TDP of 160W in a 3U design. In the interest of keeping noise levels to a minimum, a large, 92mm fan is utilized and installed via rubber mounts in lieu of traditional screws. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required.