Dynatron R15 Intel Socket 2011 1U Vapor Chamber Heatsink
Constructed from copper for optimal heat transfer and sporting vapor chamber technology, the R15 supports a CPU with maximum TDP rating of 150W. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required.The R15 passive heatsink is designed to be used in conjunction with an active cooling system; the 1U case must have active cooling, e.g., fans.
Low Stock 1 leftPassive 1U rackmount CPU cooler from Dynatron® for Intel® LGA 2011 (Socket R) Sandy Bridge server processors.
Constructed from copper for optimal heat transfer and sporting vapor chamber technology, the R15 supports a CPU with maximum TDP rating of 150W. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required.The R15 passive heatsink is designed to be used in conjunction with an active cooling system; the 1U case must have active cooling, e.g., fans.
What is a Vapor Chamber and how does that help me? A vapor chamber is, in essence, a flattened heatpipe in direct contact to the CPU surface that transfers and dissipates heat more efficientlythan a traditional heatsink can manage. The vapor chamber is air tight, containing a coolant, and operates through a continuous cycle of evaporative cooling. What this provides you with is more effective cooling and CPU thermal protection with no additional bulk.
- Solid copper heatsink with stacked-fins
- CPU Support: LGA 2011 (Socket R), Sandy Bridge - EP/EX, Intel® CoreTM i7, Xeon® E5 and other LGA 2011 processors, 150W TDP MAX
- Supports 1U+
- Shin-Etsu G751 Thermal Compound (pre-printed)
- Dimensions: 90 x 90 x 27mm, 3.54" x 3.54" x 1.06" (in inches)
- RoHS Compliance
| CPU Socket | 2011 |
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| CPU Support | Intel® Sandy Bridge EP/EX Processors |
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| Solution | 1U Server |
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| Overall Dimension | 90.0 x 90.0 x 27.0 mm |
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| Weight | 435 g |
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| Material | Vapor chamber base with Copper stacked fin |
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| Thermal Resistance VS. Cooling Fan Speed |  |
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| Note | 1. Support CPU Power up to 150 Watts 2. Thermal Grease Pre-Printed with Shin-Etsu G751 3. RoHS Compliance 4. Backplate is not included. |
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