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Gelid Solutions Slim Silent I-Plus Low Profile CPU Cooler

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Dynatron R15 Intel Socket 2011 1U Vapor Chamber Heatsink

Dynatron R15 Intel Socket 2011 1U Vapor Chamber Heatsink

Dynatron R16 Intel Socket 2011 1U Active CPU Cooler

SKU
R16

Product Details:

Active 1U rackmount CPU cooler from Dynatron® for Intel® LGA 2011 (Socket R) Sandy Bridge server processors. Constructed from copper for optimal heat transfer and sporting vapor chamber technology, the R16 supports a CPU with maximum TDP rating of 150W. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required.The R16 features a double ball-bearing, PWM blower for durability and longevity. What is a Vapor Chamber and how does that help me? A vapor chamber is, in essence, a flattened heatpipe in direct contact to the CPU surface that transfers and dissipates heat more efficientlythan a traditional heatsink can manage. The vapor chamber is air tight, containing a coolant, and operates through a continuous cycle of evaporative cooling. What this provides you with is more effective cooling and CPU thermal protection with no additional bulk.

• Recommend for Intel® Sandy Bridge - EP / EX Processor, Socket LGA 2011
• Vapor Chamber Active Cooler for 1U Server

Overall Specification:
  • Dimension: 90.0 x 90.0 x 28.0 mm
  • Weight: 390g ± 5g
  • Material: Vapor Chamber Base with Copper Stacked Fin
  • Fin Direction Perpendicular to System Airflow
  • Alloy Frame Blower with PWM function
  • Convenient Heat Sink Captive Mounting
  • Shin-Etsu G751 Thermal Grease Pre-Printed
  • Backing Plate is not included
  • Support CPU Power up to 150Watts
Blower Specification:
 
CPU Socket 2011
CPU Support Intel® Sandy Bridge EP/EX Processors
Solution 1U Solution
Overall Dimension 90.0 x 90.0 x 28.0 mm
Weight 390 g
Material Vapor Chamber Base with Copper Stacked Fin
Fan Dimension 80 x 80 x 15 mm
Speed At Duty Cycle 20%: 1000 RPM
At Duty Cycle 50%: 3500 RPM
At Duty Cycle 100%: 6000 RPM
Bearing 2 Ball Bearing
Rated Voltage 12 V
Power At Duty Cycle 20%: 0.6 W
At Duty Cycle 50%: 3.84 W
At Duty Cycle 100%: 14.4 W
Air Flow At Duty Cycle 20%: 6.5 CFM
At Duty Cycle 50%: 11.2 CFM
At Duty Cycle 100%: 19.1 CFM
Noise Level At Duty Cycle 20%: 21.5  dBA
At Duty Cycle 50%: 43.0 dBA
At Duty Cycle 100%: 55.8 dBA
Air Pressure At Duty Cycle 20%: 2.27 mm-H2O
At Duty Cycle 50%: 18.56 mm-H2O
At Duty Cycle 100%: 54.5 mm-H2O
Lead Wire Pin Out Pin1- (-)
Pin2- (+)
Pin3- (Techometer/Signal output)
Pin4- (PWM)
Cooling Performance VS. Airflow (Wind Tunnel Simulation)
Note 1. Support CPU Power up to 150 Watts
2. Pre-print thermal compound Shin-Etsu G751
3. RoHS Compliance
4. Backplate is not included
$34.95
Out of stock No Stock
More Information on Shipping

Active 1U rackmount CPU cooler from Dynatron® for Intel® LGA 2011 (Socket R) Sandy Bridge server processors. Constructed from copper for optimal heat transfer and sporting vapor chamber technology, the R16 supports a CPU with maximum TDP rating of 150W. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required.The R16 features a double ball-bearing, PWM blower for durability and longevity. What is a Vapor Chamber and how does that help me? A vapor chamber is, in essence, a flattened heatpipe in direct contact to the CPU surface that transfers and dissipates heat more efficientlythan a traditional heatsink can manage. The vapor chamber is air tight, containing a coolant, and operates through a continuous cycle of evaporative cooling. What this provides you with is more effective cooling and CPU thermal protection with no additional bulk.

Recommend for Intel® Sandy Bridge - EP / EX Processor, Socket LGA 2011

Overall Specification:

  • Dimension: 90.0 x 90.0 x 28.0 mm
  • Weight: 390g ± 5g
  • Material: Vapor Chamber Base with Copper Stacked Fin
  • Fin Direction Perpendicular to System Airflow
  • Alloy Frame Blower with PWM function
  • Convenient Heat Sink Captive Mounting
  • Shin-Etsu G751 Thermal Grease Pre-Printed
  • Backing Plate is not included
  • Support CPU Power up to 150Watts

Blower Specification:

CPU Socket 2011
CPU Support Intel® Sandy Bridge EP/EX Processors
Solution 1U Solution
Overall Dimension 90.0 x 90.0 x 28.0 mm
Weight 390 g
Material Vapor Chamber Base with Copper Stacked Fin
Fan Dimension 80 x 80 x 15 mm
Speed At Duty Cycle 20%: 1000 RPM
At Duty Cycle 50%: 3500 RPM
At Duty Cycle 100%: 6000 RPM
Bearing 2 Ball Bearing
Rated Voltage 12 V
Power At Duty Cycle 20%: 0.6 W
At Duty Cycle 50%: 3.84 W
At Duty Cycle 100%: 14.4 W
Air Flow At Duty Cycle 20%: 6.5 CFM
At Duty Cycle 50%: 11.2 CFM
At Duty Cycle 100%: 19.1 CFM
Noise Level At Duty Cycle 20%: 21.5  dBA
At Duty Cycle 50%: 43.0 dBA
At Duty Cycle 100%: 55.8 dBA
Air Pressure At Duty Cycle 20%: 2.27 mm-H2O
At Duty Cycle 50%: 18.56 mm-H2O
At Duty Cycle 100%: 54.5 mm-H2O
Lead Wire Pin Out Pin1- (-)
Pin2- (+)
Pin3- (Techometer/Signal output)
Pin4- (PWM)
Cooling Performance VS. Airflow (Wind Tunnel Simulation)
Note 1. Support CPU Power up to 150 Watts
2. Pre-print thermal compound Shin-Etsu G751
3. RoHS Compliance
4. Backplate is not included
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