Dynatron R16 Intel Socket 2011 1U Active CPU Cooler
Active 1U rackmount CPU cooler from Dynatron® for Intel® LGA 2011 (Socket R) Sandy Bridge server processors. Constructed from copper for optimal heat transfer and sporting vapor chamber technology, the R16 supports a CPU with maximum TDP rating of 150W. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required.The R16 features a double ball-bearing, PWM blower for durability and longevity. What is a Vapor Chamber and how does that help me? A vapor chamber is, in essence, a flattened heatpipe in direct contact to the CPU surface that transfers and dissipates heat more efficientlythan a traditional heatsink can manage.
Low Stock 3 leftActive 1U rackmount CPU cooler from Dynatron® for Intel® LGA 2011 (Socket R) Sandy Bridge server processors. Constructed from copper for optimal heat transfer and sporting vapor chamber technology, the R16 supports a CPU with maximum TDP rating of 150W. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required.The R16 features a double ball-bearing, PWM blower for durability and longevity. What is a Vapor Chamber and how does that help me? A vapor chamber is, in essence, a flattened heatpipe in direct contact to the CPU surface that transfers and dissipates heat more efficientlythan a traditional heatsink can manage. The vapor chamber is air tight, containing a coolant, and operates through a continuous cycle of evaporative cooling. What this provides you with is more effective cooling and CPU thermal protection with no additional bulk.
Recommend for Intel® Sandy Bridge - EP / EX Processor, Socket LGA 2011
Overall Specification:
- Dimension: 90.0 x 90.0 x 28.0 mm
- Weight: 390g ± 5g
- Material: Vapor Chamber Base with Copper Stacked Fin
- Fin Direction Perpendicular to System Airflow
- Alloy Frame Blower with PWM function
- Convenient Heat Sink Captive Mounting
- Shin-Etsu G751 Thermal Grease Pre-Printed
- Backing Plate is not included
- Support CPU Power up to 150Watts
Blower Specification:
| CPU Socket | 2011 |
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| CPU Support | Intel® Sandy Bridge EP/EX Processors |
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| Solution | 1U Solution |
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| Overall Dimension | 90.0 x 90.0 x 28.0 mm |
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| Weight | 390 g |
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| Material | Vapor Chamber Base with Copper Stacked Fin |
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| Fan Dimension | 80 x 80 x 15 mm |
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| Speed | At Duty Cycle 20%: 1000 RPM At Duty Cycle 50%: 3500 RPM At Duty Cycle 100%: 6000 RPM |
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| Bearing | 2 Ball Bearing |
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| Rated Voltage | 12 V |
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| Power | At Duty Cycle 20%: 0.6 W At Duty Cycle 50%: 3.84 W At Duty Cycle 100%: 14.4 W |
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| Air Flow | At Duty Cycle 20%: 6.5 CFM At Duty Cycle 50%: 11.2 CFM At Duty Cycle 100%: 19.1 CFM |
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| Noise Level | At Duty Cycle 20%: 21.5 dBA At Duty Cycle 50%: 43.0 dBA At Duty Cycle 100%: 55.8 dBA |
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| Air Pressure | At Duty Cycle 20%: 2.27 mm-H2O At Duty Cycle 50%: 18.56 mm-H2O At Duty Cycle 100%: 54.5 mm-H2O |
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| Lead Wire Pin Out | Pin1- (-) Pin2- (+) Pin3- (Techometer/Signal output) Pin4- (PWM) |
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| Cooling Performance VS. Airflow (Wind Tunnel Simulation) |  |
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| Note | 1. Support CPU Power up to 150 Watts 2. Pre-print thermal compound Shin-Etsu G751 3. RoHS Compliance 4. Backplate is not included |
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