Akasa Thermal gap filler-1.5mm

Akasa thermal gap filler is a thermally conductive interface pad which is versatile and suitable for use between components and their heat sinks. The pad molds around uneven surfaces and can be cut to size to effectively solve and manage unwanted thermal issues.

? Suitable for uneven surfaces
? Cut to size and stackable
? Two sizes: 1.5mm and 5mm thickness available

Size	30 x 30 x 1.5mm (AK-TT300-01) 30 x 30 x 5mm (AK-TT300-02)
Quantity	2 pcs
material	Silicone elastomer
Thermal conductivity	1.2 W/mK
Hardness (shore 00)	27 (at 3 second delay)
Density	1.78 g/cc
Temperature range	-40ºC to 160ºC
Volume resistivity	10 ^13 ohm-cm
Coefficient thermal expansion (CTE)	600 ppm/C
Product code	AK-TT300-01 (1.5 mm thickness) AK-TT300-02 (5 mm thickness)