The Dow Corning TC-5622 ThermallShin-Etsu Silicone Thermal Grease: This silicone fluid compound contains thermally-conductive fillers. With a high thermal conductivity value, this product emphasizes high bulk thermal conductivity values and ease of workability. The smaller diameter filler allows the material to achieve thinner bondlines. Ideally suited for CPU's and applications where mating surfaces have minimally uneven surfaces.y Conductive Compound is a low thermal resistance for superior heat transfer, 0.061cm²C/W @40 PSI
Shin-Etsu MicroSi Thermal Interface Material X-23-7921-5 W/m.K > 6.0 (5g) Full Kit Box Set
Shin-Etsu Silicone Thermal Grease: This silicone fluid compound contains thermally-conductive fillers. With a high thermal conductivity value, this product emphasizes high bulk thermal conductivity values and ease of workability. The smaller diameter filler allows the material to achieve thinner bondlines. Ideally suited for CPU's and applications where mating surfaces have minimally uneven surfaces.
Syringe application: Shin-Etsu MicroSi's syringes are ideal for manual applications assuring that a consistent shot weight is applied to the intended surface. Shin-Etsu MicroSi's SQC processes provide a consistent dispense weight with each syringe.
https://www.performance-pcs.com/moddiy-shin-etsu-microsi-thermal-interface-material-x-23-7921-5-6-0w-m-k-5g.html29584MODDIY Shin-Etsu MicroSi Thermal Interface Material X-23-7921-5 6.0W/m.K (5g)https://www.performance-pcs.com/media/catalog/product/s/h/shin-etsu_microsi_thermal_interface_material_x-23-7921-5_6.0_wmk__5g___4___19280_zoom.jpg19.9919.9900USDInStock/TIM's Pastes and Pads<p>The Dow Corning TC-5622 ThermallShin-Etsu Silicone Thermal Grease: This silicone fluid compound contains thermally-conductive fillers. With a high thermal conductivity value, this product emphasizes high bulk thermal conductivity values and ease of workability. The smaller diameter filler allows the material to achieve thinner bondlines. Ideally suited for CPU's and applications where mating surfaces have minimally uneven surfaces.y Conductive Compound is a low thermal resistance for superior heat transfer, 0.061cm²C/W @40 PSI</p> <p>Shin-Etsu MicroSi Thermal Interface Material X-23-7921-5 W/m.K > 6.0 (5g) Full Kit Box Set</p>
<p>Shin-Etsu Silicone Thermal Grease: This silicone fluid compound contains thermally-conductive fillers. With a high thermal conductivity value, this product emphasizes high bulk thermal conductivity values and ease of workability. The smaller diameter filler allows the material to achieve thinner bondlines. Ideally suited for CPU's and applications where mating surfaces have minimally uneven surfaces.</p>
<p>Syringe application: Shin-Etsu MicroSi's syringes are ideal for manual applications assuring that a consistent shot weight is applied to the intended surface. Shin-Etsu MicroSi's SQC processes provide a consistent dispense weight with each syringe.</p>
<p><span style="font-family: tahoma,arial,helvetica,sans-serif; font-size: small;"><strong><span style="font-size: large; color: #ff0000;">*Note: This Item can not be shipped using DHL*</span><br /></strong></span></p>ModDIY0014.9900add-to-cartModDIYGrayPaste<p>Â </p>
<ul>
<li>Optimal efficiency and thermal transfer.</li>
<li>Convenient syringe for easy application.</li>
<li>High performance thermal grease. Good for general applications. Especially on uneven surface.</li>
<li>Injector with cap for easy application and storage</li>
</ul>
<p>Â </p><p>Â </p>
<ul>
<li>Thermal Conductivity: 6.0 (W/m K)</li>
<li>Specific Gravity: 2.6</li>
<li>Electrically non-conductive</li>
<li>Viscosity: (Pa.s @ 25C) 250</li>
<li>Storage Conditions 60F to 85F (15C - 29C)</li>
</ul>
<p>Â </p>
/TIM's Pastes and Pads1202TIM's Pastes and Padshttps://www.performance-pcs.com/tim-s-pastes-and-pads.htmlhttps://www.performance-pcs.com/media/catalog/category/TIM_s.jpg12
Low Stock 4 left
Download PDF 
