CPU Liquid metal thermal pad 40x40mm

This liquid metal thermal pad features high thermal conductivity and excellent heat transfer. In addition, it has been insulated against electric conduction of liquid metals to ensure long-term operational safety and stability of CPUs

• Size: 40x40mm


• Thermal conductivity: 80W/M K


• Resistivity: 0.9x10-7 ohm M


• Specific gravity: 5.2 g/ml


• Volatilization rate: <0.001%


• Use temperature: -40 degrees Celsius - 500 degrees Celsius


• Corrosion: aluminum corrosion


• Other features: high thermal conductivity, excellent heat transfer performance.


• Aiming at the problem of liquid metal conduction, the insulation of heat conduction plate is processed.


• CPU long term safe temperature operation can be guaranteed.