Copper/Aluminum
Dynatron G17 3U Server & Up CPU Heatsink - Socket LGA 1366
G17-D
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Details
Product Details:
Dynatron G17 CPU Cooler for socket 1366, Workstation & Tower Desktop Solution
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Specifications
Specifications: Â Â
CPU Socket
1366
CPU Support
Intel® Xeon® Processor 5000 Series & Xeon® Processor W3690, W3680, W3670, W3580, W3570, W3565, W3550, W3540, W3530, W3520
Solution
3U&Up, Workstation & Tower Desktop Solution
Overall Dimension
91.0 x 91.0 x 110.0Â mm
Weight
530Â g
Material
Aluminum Fins, 4x Heat Pipes with H.C.C. Technology
Fan Dimension
Ã?92 x 25Â mm
Speed
At Duty Cycle 20%:Â 1000 RPM
At Duty Cycle 50%: 1800 RPM
At Duty Cycle 100%: 2500Â RPM
Bearing
2 Ball Bearing
Rated Voltage
12 V
Power
At Duty Cycle 20%: 0.96 W
At Duty Cycle 50%:Â 1.44 W
At Duty Cycle 100%:Â 3.0 W
Air Flow
At Duty Cycle 20%:Â 17.34 CFM
At Duty Cycle 50%:Â 31.21 CFM
At Duty Cycle 100%:Â 43.36Â CFM
Noise Level
At Duty Cycle 20%:Â 17.0Â Â dBA
At Duty Cycle 50%:Â 24.78 dBA
At Duty Cycle 100%:Â 31.92Â dBA
Air Pressure
At Duty Cycle 20%:Â 0.48 mm-H2O
At Duty Cycle 50%:Â 1.55 mm-H2O
At Duty Cycle 100%:Â 3.0 mm-H2O
Lead Wire Pin Out
Pin1- (-)
Pin2- (+)
Pin3- (Techometer/Signal output)
Pin4- (PWM)
Cooling Performance VS. Airflow (Wind Tunnel Simulation)
Note
1. Support CPU Power up to 140 Watts OverclockingÂ
2. Pre-print thermal compound Shin-Etsu G751
3. RoHS Compliance
4. Backplate is not included
