Dynatron K17 3U CPU Cooler Heatpipes, Intel LGA 1155 / 1156, i7, Xeon, Socket H2

Active 3U CPU cooler from Dynatron® for Intel® LGA 1155 / 1156 (Socket H2, H) server processors. The K17 3U CPU cooler is comprised of multiple design elements. The alumium heatsink provides optimal heat transfer and dissipation and is aligned (fin direction parallel to airflow) to the 92mm fan on its side. 4 copper heatpipes, with direct contact to the CPU, are employed to enhance heat transfer away from the CPU. The heatpipes are split up both sides of the heatsink to maximize travel and efficiency. Using this design, the K17 is able to provide cooling for processors with a maximum TDP of 160W in a 3U design. In the interest of keeping noise levels to a minimum, a large, 92mm fan is utilized and installed via rubber mounts in lieu of traditional screws. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required.

CPU Socket	1155/1156
CPU Support	LGA1155: Intel® Xeon® Server Processor E3 Series Intel® Core i7 Desktop Processor 2600, 2600K, 880, 875K, 870, 870S, 860, 860S Intel® Core i5 Desktop Processor 2500,2400,2310,2300,760,750,750S, 680,670,661,660,655K, 650 Intel® Core i3 Desktop Processor 2100,560,550,540,530 Pentium® Desktop Processor G850, G840, G6960, G6950, G620, G620T
Solution	3U&Up & Workstation Solution
Overall Dimension	91.0 x 91.0 x 110.0 mm
Weight	530 g
Material	Aluminum Fins, 4x Heat Pipes with H.C.C. Technology
Fan Dimension	Ø92 x 25 mm
Speed	At Duty Cycle 20%: 1000 RPM At Duty Cycle 50%: 1800 RPM At Duty Cycle 100%: 2500 RPM
Bearing	2 Ball Bearing
Rated Voltage	12 V
Power	At Duty Cycle 20%: 0.96 W At Duty Cycle 50%: 1.44 W At Duty Cycle 100%: 3.0 W
Air Flow	At Duty Cycle 20%: 17.34 CFM At Duty Cycle 50%: 31.21 CFM At Duty Cycle 100%: 43.36 CFM
Noise Level	At Duty Cycle 20%: 17.0  dBA At Duty Cycle 50%: 24.78 dBA At Duty Cycle 100%: 31.92 dBA
Air Pressure	At Duty Cycle 20%: 0.48 mm-H2O At Duty Cycle 50%: 1.55 mm-H2O At Duty Cycle 100%: 3.0 mm-H2O
Lead Wire Pin Out	Pin1- (-) Pin2- (+) Pin3- (Techometer/Signal output) Pin4- (PWM)
Note	1. Support CPU Power up to 105 Watts Overclocking  2. Pre-print thermal compound Shin-Etsu G751 3. RoHS Compliance 4. Backplate is not included

 Cooling performance vs Airflow