Copper/Aluminum

Dynatron K650 Active Heatsink for 2U Servers - Socket LGA1156

K650-D

Dynatron Active Heat Sink for 2U Server. Recommend for Intel® Core� i5 I5-750; Xeon® Processor 3400 Series; Core� i7 Processors I7-870 & I7-860; Socket LGA1156


 


 

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Details

Product Details:

Dynatron Active Heat Sink for 2U Server. Recommend for Intel ® Core ? i5 I5-750; Xeon ® Processor 3400 Series; Core ? i7 Processors I7-870 & I7-860; Socket LGA1156



Features

Features:











Specifications

Specifications:

























































































































CPU Socket 1156
CPU Support Intel® Core� i5 I5-750; Xeon® Processor 3400 Series; Core� i7 Processors, I7-870 & I7-860
Solution 2U&Up Server
Overall Dimension 88.5 x 87.0 x 64.0 mm
Weight 460 g
Material Copper Base with Aluminum Stacked Fin
Fan Dimension 60 x 60 x 25 mm
Speed At Duty Cycle 0~20%: 1400 RPM
At Duty Cycle 50%: 3500 RPM
At Duty Cycle 100%: 7000 RPM
Bearing 2 Ball Bearing
Rated Voltage 12 V
Power At Duty Cycle 0~20%: 0.6 W
At Duty Cycle 50%: 1.20 W
At Duty Cycle 100%: 5.4 W
Air Flow At Duty Cycle 0~20%: 7.405 CFM
At Duty Cycle 50%: 18.517 CFM
At Duty Cycle 100%: 38.283 CFM
Noise Level At Duty Cycle 0~20%: 20.8 dBA
At Duty Cycle 50%: 35.9 dBA
At Duty Cycle 100%: 48.1 dBA
Air Pressure At Duty Cycle 0~20%: 0.574mm-H2O
At Duty Cycle 50%: 3.586mm-H2O
At Duty Cycle 100%: 13.552mm-H2O
Lead Wire Pin Out Pin1-Black (-)
Pin2-Yellow (+)
Pin3-Green (Techometer/Signal output)
Pin4-Blue (PWM)
Thermal Resistance & Noise Level VS. Cooling Fan Speed
Note 1. Thermal Grease Pre-Printed with GE-Toshiba TIG830SP
2. RoHS Compliance

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