Dynatron R15 Intel Socket 2011 1U Vapor Chamber Heatsink

Passive 1U rackmount CPU cooler from Dynatron® for Intel® LGA 2011 (Socket R) Sandy Bridge server processors.

Constructed from copper for optimal heat transfer and sporting vapor chamber technology, the R15 supports a CPU with maximum TDP rating of 150W. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required.The R15 passive heatsink is designed to be used in conjunction with an active cooling system; the 1U case must have active cooling, e.g., fans.

What is a Vapor Chamber and how does that help me? A vapor chamber is, in essence, a flattened heatpipe in direct contact to the CPU surface that transfers and dissipates heat more efficientlythan a traditional heatsink can manage. The vapor chamber is air tight, containing a coolant, and operates through a continuous cycle of evaporative cooling. What this provides you with is more effective cooling and CPU thermal protection with no additional bulk.

• Solid copper heatsink with stacked-fins


• CPU Support: LGA 2011 (Socket R), Sandy Bridge - EP/EX, Intel® CoreTM i7, Xeon® E5 and other LGA 2011 processors, 150W TDP MAX


• Supports 1U+


• Shin-Etsu G751 Thermal Compound (pre-printed)


• Dimensions: 90 x 90 x 27mm, 3.54 x 3.54 x 1.06 (in inches)


• RoHS Compliance

CPU Socket	2011
CPU Support	Intel® Sandy Bridge EP/EX Processors
Solution	1U Server
Overall Dimension	90.0 x 90.0 x 27.0  mm
Weight	435 g
Material	Vapor chamber base with Copper stacked fin
Thermal Resistance VS. Cooling Fan Speed
Note	1. Support CPU Power up to 150 Watts 2. Thermal Grease Pre-Printed with Shin-Etsu G751 3. RoHS Compliance 4. Backplate is not included.