Dynatron R16 Intel Socket 2011 1U Active CPU Cooler

Active 1U rackmount CPU cooler from Dynatron® for Intel® LGA 2011 (Socket R) Sandy Bridge server processors. Constructed from copper for optimal heat transfer and sporting vapor chamber technology, the R16 supports a CPU with maximum TDP rating of 150W. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required.The R16 features a double ball-bearing, PWM blower for durability and longevity. What is a Vapor Chamber and how does that help me? A vapor chamber is, in essence, a flattened heatpipe in direct contact to the CPU surface that transfers and dissipates heat more efficientlythan a traditional heatsink can manage. The vapor chamber is air tight, containing a coolant, and operates through a continuous cycle of evaporative cooling. What this provides you with is more effective cooling and CPU thermal protection with no additional bulk.

Recommend for Intel® Sandy Bridge - EP / EX Processor, Socket LGA 2011

Overall Specification:

• Dimension: 90.0 x 90.0 x 28.0 mm


• Weight: 390g ± 5g


• Material: Vapor Chamber Base with Copper Stacked Fin


• Fin Direction Perpendicular to System Airflow


• Alloy Frame Blower with PWM function


• Convenient Heat Sink Captive Mounting


• Shin-Etsu G751 Thermal Grease Pre-Printed


• Backing Plate is not included


• Support CPU Power up to 150Watts

Blower Specification:

CPU Socket	2011
CPU Support	Intel® Sandy Bridge EP/EX Processors
Solution	1U Solution
Overall Dimension	90.0 x 90.0 x 28.0 mm
Weight	390 g
Material	Vapor Chamber Base with Copper Stacked Fin
Fan Dimension	80 x 80 x 15 mm
Speed	At Duty Cycle 20%: 1000 RPM At Duty Cycle 50%: 3500 RPM At Duty Cycle 100%: 6000 RPM
Bearing	2 Ball Bearing
Rated Voltage	12 V
Power	At Duty Cycle 20%: 0.6 W At Duty Cycle 50%: 3.84 W At Duty Cycle 100%: 14.4 W
Air Flow	At Duty Cycle 20%: 6.5 CFM At Duty Cycle 50%: 11.2 CFM At Duty Cycle 100%: 19.1 CFM
Noise Level	At Duty Cycle 20%: 21.5  dBA At Duty Cycle 50%: 43.0 dBA At Duty Cycle 100%: 55.8 dBA
Air Pressure	At Duty Cycle 20%: 2.27 mm-H2O At Duty Cycle 50%: 18.56 mm-H2O At Duty Cycle 100%: 54.5 mm-H2O
Lead Wire Pin Out	Pin1- (-) Pin2- (+) Pin3- (Techometer/Signal output) Pin4- (PWM)
Cooling Performance VS. Airflow (Wind Tunnel Simulation)
Note	1. Support CPU Power up to 150 Watts 2. Pre-print thermal compound Shin-Etsu G751 3. RoHS Compliance 4. Backplate is not included