Aluminum

Dynatron R17 3U Intel 2011 Sandy Bridge CPU Cooler

R17

Intel Sandy Bridge Romley-EP/EX Processors up to TDP 160 Watts overclocking for socket 2011 3U&Up Server, Workstation, Tower Desktop Solution

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Details

Intel Sandy Bridge Romley-EP/EX Processors up to TDP 160 Watts overclocking for socket 2011 3U&Up Server, Workstation, Tower Desktop Solution

Specifications































































































































CPU Socket 2011 (Square Type, 80 x 80mm mounting pitch)
CPU Support Intel® Sandy Bridge Romley-EP/EX Processors up to TDP 160 Watts overclocking
Solution 3U&Up, Workstation & Tower Desktop Solution
Overall Dimension 91.0 x 91.0 x 110.0 mm
Weight 530 g
Material Aluminum Fins, 4x Heat Pipes with H.C.C. Technology
Fan Dimension Ø92 x 25 mm
Speed At Duty Cycle 20%: 1000 RPM
At Duty Cycle 50%: 1800 RPM
At Duty Cycle 100%: 2500 RPM
Bearing 2 Ball Bearing
Rated Voltage 12 V
Power At Duty Cycle 20%: 0.96 W
At Duty Cycle 50%: 1.44 W
At Duty Cycle 100%: 3.0 W
Air Flow At Duty Cycle 20%: 17.34 CFM
At Duty Cycle 50%: 31.21 CFM
At Duty Cycle 100%: 43.36 CFM
Noise Level At Duty Cycle 20%: 17.0  dBA
At Duty Cycle 50%: 24.78 dBA
At Duty Cycle 100%: 31.92 dBA
Air Pressure At Duty Cycle 20%: 0.48 mm-H2O
At Duty Cycle 50%: 1.55 mm-H2O
At Duty Cycle 100%: 3.0 mm-H2O
Lead Wire Pin Out Pin1- (-)
Pin2- (+)
Pin3- (Techometer/Signal output)
Pin4- (PWM)
Cooling Performance VS. Airflow (Wind Tunnel Simulation)
Note 1. Support CPU Power up to 160 Watts
2. Pre-print thermal compound Shin-Etsu G751
3. RoHS Compliance
4. Backplate is not included

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