Copper
Enzotech MST-66 Forged Copper Mosfet Heatsink
MST-66
ENZOTECH MST-66 heatsink was designed to offer Specifications:Product Details:
exceptional heat dissipation for integrated MOSFET motherboards cards. MST-66
heatsink is made using a forged copper process which produces a dense material
that is extremely efficient at heat extraction. The MST-66 heatsink is far
superior to traditional heat sinks currently found on the market and it provides
the best thermal conductivity available to dissipate heat from the MOSFET in
your system..
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Dimensions (mm)
72(L) x 13(W)
x 29.6(H)
Material
C1100 Forged Copper
Weight
55g
Thermal Adhesive
Fujipoly GR-d Thermal Tape
SUPPORTED MB
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GigaByte
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EX58-UD5,EX58-UD4P,EX58-Extreme,GA-P35-DS3P,GA-P35-DS4,GA-P35-DQ6,GA-EP45-DS3P,GA-EP45-DS4,GA-EP45-DS5,GA-EP45-DQ6,GA-EP45-Extreme,GA-EP45T-Extreme
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Details
Product Details:
ENZOTECH MST-66 heatsink was designed to offer exceptional heat dissipation for integrated MOSFET motherboards cards. MST-66 heatsink is made using a forged copper process which produces a dense material that is extremely efficient at heat extraction. The MST-66 heatsink is far superior to traditional heat sinks currently found on the market and it provides the best thermal conductivity available to dissipate heat from the MOSFET in your system..
Specifications:
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