Feser H-Bridge CPU / GPU / NB / MOSFET Thermal Compound - 5g

The Feser Company (TFC) is one of the specialists among the manufacturers of water cooling and is expanding its offerings in this area. In the wake of this development is a separate thermal compound in the name of H-Bridge.

The layer between the cooler and the heat source should never be forgotten. Both surfaces look flat , but microscopic valleys are always present and thus never 100% contact is impossible to achieve. A thermal compound fills gaps and allows a transfer of heat over the entire surface.

With a thermal conductivity of 9.24 W / m ° C is a remarkable performer. The thermal paste is suitable for all types of coolers suitable: CPU, GPU, Chipset, voltage transformers, etc. The compound is suitable over a temperature range of -30 to +200 ° C guaranteed. With 5g, the amount per tube is plenty for many applications.

*Note: This Item can not be shipped using DHL*

Thermal Conductivity:	3.8 W/m-K
Thermal Impedence:	0.087 U2/W
Specific Gravity:	2.5
Dielectric Constant A (100Hz):	5.1
Viscosity:	No Flowing
Thixotropic Index:	380±10 / 10mm
Operation Temp:	-50~240
Silicone Compunds:	50%
Carbon Compounds:	20%
Metal Oxide Compounds:	30%
Content Syringe:	5g