JunPus High Thermal Pad P600 - 100 x 100 x 1.0mm

JP-P600 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure.

JPP600 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity.

So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly.

JP-P600 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.

Applications:

• Electronic components: IC, CPU, MOS, LED, M/B, P/S, HEAT SINK, LCD-TV, N/B PC, PC, Telecom Device, Wireless Hub etc.
• DDR II Module, DVD Applications, Hand-set applications etc

• Very good insulator


• Easy to assembly


• Good thermal conductivity


• Ultra soft and high compressibility


• Natural tack

Test item	Test method	Unit	Test value
			JP-P600 value	JP-P520 value
Color	Visual		blue/red	yellow/blue
Thickness	ASTM D374	Mm	0.25~5.0	0.25~5.0
Density	ASTM D792	g/cc	2.8	2.8
Hardness	ASTM D2240	Shore C	30±5	30±5
Tensile Strength	ASTMD412	KN/m	0.4	0.4
Continuous use Temp	EN344	â??	-40~+220	-40~+220
Volume Resistivity	ASTM D257	O-cm	2.2×1011	3.2×1011
Voltage Endu Ance	ASTM D149	KV/mm	>5.0	>5.0
Thermal impedance	ASTM-D5470	â??in2/W	0.2	0.3
Flame Rating	UL-94		V-0	V-0
Conductivity	ASTM-D5470	w/m-k	6.0	5.2

Thickness:1.0mm
Dimension:100mm x 100mm