Features:
Durable enough To Resist Pump-Out Effect
The pump-out effect occurs when thermal paste is gradually squeezed out between the heat spreader and the CPU cooler?s base plate due to deformation from temperature changes under load. Materials like silicon and copper have different thermal expansion rates, which makes the effect more pronounced, especially with a copper cooler on a graphics chip. At lower temperatures, the pump-out effect is less severe, making X-10, with its low viscosity, ideal for CPUs with lower heat output. Signs that the thermal paste needs replacing include rising CPU temperatures and reduced clock speeds.

Optimized for Air, Water Cooling and beyond
The X-10 thermal compound combines excellent performance with user-friendly application, making it perfect for both beginners and expeirnced PC users. Designed for optimal heat transfer in both CPU and GPU cooling, X-10 excels in air and water-cooled systems and even in demanding professional conditions. Whether you?re maintaining your everyday PC or fine-tuning a high-end custom PC build, X-10 guarantees lower temperatures and consistent, reliable cooling.
Application Aids

Every Polartherm thermal compound comes equipped with applicators and spatulas, providing you with three convenient application methods:
- Direct Application: Apply the paste directly to the CPU without a spatula or applicator. Once the cooler is mounted, the pressure will evenly distribute the paste, filling in microscopic gaps.
- Spatula Method: Use the included spatula to spread the compound across the CPU surface. The cooler will compress the paste, ensuring full coverage even in the smallest areas.
- Applicator Method: Squeeze the paste directly onto the CPU heat spreader using the provided applicator, ensuring a thin, even layer. The cooler pressure will then fill any remaining gaps.