Aluminum
Swiftech Heatsink ATI Radeon HD 6870 & 6950 Series Reference Design
HD6900-HS-D
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Details
The HD6900 heatsink is designed to cool surface mount components (memory, and mosfets) on ATI Radeon ? HD 6950 as well as HD 6870 Series reference design graphics cards which Brand Models are listed hereafter. The Heatsink is designed to be installed in conjunction with our MCW60, MCW80 and MCW82 VGA waterblocks and to allow stable overclocks of these mid-range graphic cards while keeping them cool and silent.
The performance advantage of hybrid cooling which consists in cooling the GPU with a universal waterblock in combination with a heatsink compared to using a full-cover water-block solutions is well known among enthusiast users: improved thermal dissipation at the GPU level thanks to Swiftech's Diamond Pin Matrix and a better TIM joint, and less heat dumped into the liquid cooling loop coming from memory, and power MOSFETS since they remain air cooled. In addition, this combination provides a complete solution that is more economical than full-cover waterblocks because the GPU waterblock can be re-used over time with different VGA cards.
The performance advantage of hybrid cooling which consists in cooling the GPU with a universal waterblock in combination with a heatsink compared to using a full-cover water-block solutions is well known among enthusiast users: improved thermal dissipation at the GPU level thanks to Swiftech's Diamond Pin Matrix and a better TIM joint, and less heat dumped into the liquid cooling loop coming from memory, and power MOSFETS since they remain air cooled. In addition, this combination provides a complete solution that is more economical than full-cover waterblocks because the GPU waterblock can be re-used over time with different VGA cards.
The heatsink is a custom Aluminum extrusions, and it is precision CNC machined to allow optimum TIM joints with the hottest components such as the voltage regulator modules, where high performance thermal grease is to be used. Less heat intensive components such as memory receive pre-applied thermal pads, as shown below.
