Copper

Thermaltake Intel LLGA775 Skived Heatsink 1U Sleeved

CL-P0187-D



Thermaltake Intel LLGA775 Skived Heatsink 1U Sleeved



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Details

Thermaltake Intel LLGA775 Skived Heatsink 1U Sleeved

Features


  • Application for Intel LGA775 Performance 115W

  • All copper base & Copper Fins Skived Technology

  • Shin Etsu-G751 interface material, made perform well

  • Bundle with LGA775 back plate

Specifications





















































P/N


CL-P0187


Max Air Flow


30.5 CFM


Fan Dimension


70x70x10 mm


Heatsink Dimension


90x90x13.5 mm

Max. Air Pressure
4.49 mm H2O


Rated Voltage


12V


Started Voltage


5V


Bearing Type


1 Ball & 1 Sleeve


Rated Current


0.45A


Noise


36 dBA


Power Input


5.4W


Life Expectation


50,000 hrs


Connector


3 Pin



Fan Speed


4800 ± 10%RPM


Thermal Interface


Shin Etsu-G751

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