Shin-Etsu X23 Thermal Compound (Model X23-7783D) - This thermal interface compound is developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. Shin-Etsu MicroSi's X23-7783D product offering utilizes fillers that have a controlled diameter. The smaller diameter filler allows the material to achieve thinner bondlines. For best results, this material should be used in applications where the hills and valleys of the mating surfaces are minimal.
Shin-Etsu X23 Thermal Compound (Model X23-7783D) - This thermal interface compound is developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. Shin-Etsu MicroSi's X23-7783D product offering utilizes fillers that have a controlled diameter. The smaller diameter filler allows the material to achieve thinner bondlines. For best results, this material should be used in applications where the hills and valleys of the mating surfaces are minimal.
https://www.performance-pcs.com/shin-etsu-x23-7783d-thermal-compount-0-5-gram-tube-x23-7783d-0-5g.html4269SHIN-ETSU X23-7783D Thermal Compount 0.5 Gram Tubehttps://www.performance-pcs.com/media/catalog/product/t/m/tmpx23-7783d_01_1.jpg3.953.9500USDOutOfStock/TIM's Pastes and Pads<p>Shin-Etsu X23 Thermal Compound (Model X23-7783D) - This thermal interface compound is developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. Shin-Etsu MicroSi's X23-7783D product offering utilizes fillers that have a controlled diameter. The smaller diameter filler allows the material to achieve thinner bondlines. For best results, this material should be used in applications where the hills and valleys of the mating surfaces are minimal.</p> <p>Shin-Etsu X23 Thermal Compound (Model X23-7783D) - This thermal interface compound is developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. Shin-Etsu MicroSi's X23-7783D product offering utilizes fillers that have a controlled diameter. The smaller diameter filler allows the material to achieve thinner bondlines. For best results, this material should be used in applications where the hills and valleys of the mating surfaces are minimal.</p>
<p><span style="font-family: tahoma,arial,helvetica,sans-serif; font-size: small;" red="" face="tahoma,arial,helvetica,sans-serif" size="2"><strong><span style="font-size: large; color: #ff0000;">*Note: This Item can not be shipped using DHL*</span><br /></strong></span></p>003.0400add-to-cartlow-stockPaste<ul>
<li><span style="font-family: tahoma,arial,helvetica,sans-serif;" face="tahoma,arial,helvetica,sans-serif"><span style="font-size: small;" size="2">Injector with cap for easy application and storage </span></span><span style="font-family: Arial,Helvetica;" face="Arial, Helvetica"></span></li>
<li><span style="font-family: tahoma,arial,helvetica,sans-serif;" face="tahoma,arial,helvetica,sans-serif"><span style="font-size: small;" size="2">High performance thermal grease. Ideally suited for applications where the mating surfaces have minimal "hills and valleys". </span></span></li>
<li><span style="font-family: tahoma,arial,helvetica,sans-serif;" face="tahoma,arial,helvetica,sans-serif"><span style="font-size: small;" size="2">0.50gm syringe (comes in 1cc syringe) </span></span></li>
</ul><ul>
<li><span style="font-family: tahoma,arial,helvetica,sans-serif;" face="tahoma,arial,helvetica,sans-serif"><span style="font-size: small;" size="2">Thermal Conductivity: 6.0 (W/m °K) </span></span></li>
<li><span style="font-family: tahoma,arial,helvetica,sans-serif;" face="tahoma,arial,helvetica,sans-serif"><span style="font-size: small;" size="2">Specific Gravity: 2.6 </span></span></li>
<li><span style="font-family: tahoma,arial,helvetica,sans-serif;" face="tahoma,arial,helvetica,sans-serif"><span style="font-size: small;" size="2">Electrically non-conductive </span></span></li>
<li><span style="font-family: tahoma,arial,helvetica,sans-serif;" face="tahoma,arial,helvetica,sans-serif"><span style="font-size: small;" size="2">Viscosity: (Pa.s @ 25C) 250 </span></span></li>
<li><span style="font-family: tahoma,arial,helvetica,sans-serif; font-size: small;" size="2" face="tahoma,arial,helvetica,sans-serif">Storage Conditions 60°F to 85°F (15°C - 29°C)</span></li>
</ul>
/TIM's Pastes and Pads1202TIM's Pastes and Padshttps://www.performance-pcs.com/tim-s-pastes-and-pads.htmlhttps://www.performance-pcs.com/media/catalog/category/TIM_s.jpg12