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Dow Corning TC-5622  Thermally Conductive Compound (3.5g)

Dow Corning TC-5622 Thermally Conductive Compound (3.5g)

Akasa Thermal gap filler-5mm

Akasa Thermal gap filler-5mm

Akasa Thermal gap filler-1.5mm

SKU
AK-TT300-01

Akasa thermal gap filler is a thermally conductive interface pad which is versatile and suitable for use between components and their heat sinks. The pad molds around uneven surfaces and can be cut to size to effectively solve and manage unwanted thermal issues.

$5.99
In stock Good Stock 35 left
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Akasa thermal gap filler is a thermally conductive interface pad which is versatile and suitable for use between components and their heat sinks. The pad molds around uneven surfaces and can be cut to size to effectively solve and manage unwanted thermal issues.

Suitable for uneven surfaces
Cut to size and stackable
Two sizes: 1.5mm and 5mm thickness available

Size 30 x 30 x 1.5mm (AK-TT300-01)
30 x 30 x 5mm (AK-TT300-02)
Quantity 2 pcs
material Silicone elastomer
Thermal conductivity 1.2 W/mK
Hardness (shore 00) 27 (at 3 second delay)
Density 1.78 g/cc
Temperature range -40ºC to 160ºC
Volume resistivity 10 ^13 ohm-cm
Coefficient thermal expansion (CTE) 600 ppm/C
Product code AK-TT300-01 (1.5 mm thickness)
AK-TT300-02 (5 mm thickness)
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