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 Thermal pad Ultra 5W/mk 30x30x2mm (1 piece)

Thermal pad Ultra 5W/mk 30x30x2mm (1 piece)

Arctic Silver 5 High-Density Polysynthetic Silver Thermal Compound-12g

Arctic Silver 5 High-Density Polysynthetic Silver Thermal Compound-12g

Arctic Silver 5 High-Density Polysynthetic Silver Thermal Compound-12g

SKU
AS5-12G

Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. Arctic Silver 5 thermal compound does this with three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. It's optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions. This 12-gram tube contains enough compound to cover at least 50 small CPU cores, or 20 large CPU cores, or 7 to 15 heat plates.

Special Price $20.90 was $29.85
In stock Low Stock 5 left
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Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. Arctic Silver 5 thermal compound does this with three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. It's optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions. This 12-gram tube contains enough compound to cover at least 50 small CPU cores, or 20 large CPU cores, or 7 to 15 heat plates.

*Note: This Item can not be shipped using DHL*

  • 99.9% Pure Silver The Arctic Silver 5 uses three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer.

  • High Density The Arctic Silver 5 contains over 88% thermally conductive filler by weight. The thermally-enhanced ceramic particles including micronized silver, sub-micron zinc oxide, aluminum oxide and boron nitride particles improve the compound's performance and long-term stability.
Brand
Arctic Silver
Model
AS5-12G

Details

Specifications
Average Particle Size:
<0.49 micron <0.000020 inch
Extended Temperature Limits:
Peak: -50 Degrees C to >180 Degrees C
Long-Term: -50 Degrees C to 130 Degrees C


Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.


Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.

Features

Features
12-gram

Plug Standards

Electrical Outlet Plug Type
Thermal Compound

Group

Weight
30g
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