Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. Arctic Silver 5 thermal compound does this with three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. It's optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions. This 12-gram tube contains enough compound to cover at least 50 small CPU cores, or 20 large CPU cores, or 7 to 15 heat plates.
Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. Arctic Silver 5 thermal compound does this with three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. It's optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions. This 12-gram tube contains enough compound to cover at least 50 small CPU cores, or 20 large CPU cores, or 7 to 15 heat plates.
99.9% Pure Silver The Arctic Silver 5 uses three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer.
High Density The Arctic Silver 5 contains over 88% thermally conductive filler by weight. The thermally-enhanced ceramic particles including micronized silver, sub-micron zinc oxide, aluminum oxide and boron nitride particles improve the compound's performance and long-term stability.
https://www.performance-pcs.com/arctic-silver-5-high-density-polysynthetic-silver-thermal-compound-12g-as5-12g.html17565Arctic Silver 5 High-Density Polysynthetic Silver Thermal Compound-12ghttps://www.performance-pcs.com/media/catalog/product/t/m/tmpa2w0_130706238794903258osdicuqigg.jpg29.8529.8500USDInStock/TIM's Pastes and Pads<p>Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. Arctic Silver 5 thermal compound does this with three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. It's optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions. This 12-gram tube contains enough compound to cover at least 50 small CPU cores, or 20 large CPU cores, or 7 to 15 heat plates.</p> <p>Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. Arctic Silver 5 thermal compound does this with three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. It's optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions. This 12-gram tube contains enough compound to cover at least 50 small CPU cores, or 20 large CPU cores, or 7 to 15 heat plates.</p>
<p><span style="font-family: tahoma,arial,helvetica,sans-serif; font-size: small;" red="" face="tahoma,arial,helvetica,sans-serif" size="2"><strong><span style="font-size: large; color: #ff0000;">*Note: This Item can not be shipped using DHL*</span><br /></strong></span></p>Arctic Silver0016.6500add-to-cartArctic SilverPaste832199001021<p></p>
<ul class="grpFeatures" id="hightlights">
<li><span class="content"><em class="title">99.9% Pure Silver</em> The Arctic Silver 5 uses three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer.<br /><br /></span></li>
<li><span class="content"><em class="content">High Density</em> The Arctic Silver 5 contains over 88% thermally conductive filler by weight. The thermally-enhanced ceramic particles including micronized silver, sub-micron zinc oxide, aluminum oxide and boron nitride particles improve the compound's performance and long-term stability. </span></li>
</ul><dl><dt>Brand</dt><dd>Arctic Silver</dd></dl><dl><dt>Model</dt><dd>AS5-12G</dd></dl><fieldset>
<h3 class="specTitle">Details</h3>
<dl><dt>Specifications</dt><dd>Average Particle Size:<br /><0.49 micron <0.000020 inch<br />Extended Temperature Limits:<br />Peak: -50 Degrees C to >180 Degrees C <br />Long-Term: -50 Degrees C to 130 Degrees C <br /><br /><br />Performance:<br />3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.<br /><br /><br />Coverage Area:<br />A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.</dd></dl></fieldset><fieldset>
<h3 class="specTitle">Features</h3>
<dl><dt>Features</dt><dd>12-gram</dd></dl></fieldset><fieldset>
<h3 class="specTitle">Plug Standards</h3>
<dl><dt><a id="def_colorPopup__40021" name="def-color" rel="modal1"></a>Electrical Outlet Plug Type</dt><dd>Thermal Compound</dd></dl></fieldset><fieldset>
<h3 class="specTitle">Group</h3>
<dl><dt>Weight</dt><dd>30g</dd></dl></fieldset>
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