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Coollaboratory MetalPad (100% Liquid Metal) Thermal Interface Material - CPU - 3 Pads

SKU
COOLLABORATORY-CPUX3

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The Coollaboratory Liquid MetalPad Thermal Interface Pad is the first heat conduction pad composed of 100% metal and melts with heat from the processor (Burn In-process), and then it performs superior heat transfer. It dissipates the heat fast and efficiently, outperforming the best heat conduction pastes. The simple, clean and fast installation turns the Liquid MetalPad into the ultimate heat conduction medium for High End PCs.

$14.99
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The Coollaboratory Liquid MetalPad Thermal Interface Pad is the first heat conduction pad composed of 100% metal and melts with heat from the processor (Burn In-process), and then it performs superior heat transfer. It dissipates the heat fast and efficiently, outperforming the best heat conduction pastes. The simple, clean and fast installation turns the Liquid MetalPad into the ultimate heat conduction medium for High End PCs.

The Liquid MetalPad can be used with all on the cooling market commercially available materials, for instance aluminum or copper! It doesn´t age and doesn´t have to be exchanged regularly. The Coollaboratory Liquid MetalPad is RoHS compatible and absolute nontoxic.

The Coollaboratory Liquid MetalPad is delivered in a transparent blister-package and contains three Liquid MetalPads. Additionally there is a detailed printed manual included and a cleaning set for removal / cleaning of the contact area before and after using the Liquid MetalPad.

*Note: This Item can not be shipped using DHL*

Download Manual (PDF)

Download the Material Safety Data Sheet

Features:

  • Melts on to processor during "burn in" for best thermal conductivity
  • Precut metal pads fit perfectly on AMD and Intel Processors - set it and forget it!
  • Cleaning Set included to prepare the processor for application of the metal pad
  • No more leaky syringes and no more stained fingers - the metal pads are easy to use!

Specifications:

Metal Pads: 3
Cleaning Sets: Included
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