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Dow Corning TC-5625  Thermally Conductive Compound (3.5g)

Dow Corning TC-5625 Thermally Conductive Compound (3.5g)

Dow Corning TC-5688  Thermally Conductive Compound (3.5g) - 8.0w/m.k

Dow Corning TC-5688 Thermally Conductive Compound (3.5g) - 8.0w/m.k

Dow Corning TC-5688 Thermally Conductive Compound (3.5g) - 8.0w/m.k

SKU
MDY-TC-5688
$19.99
In stock Good Stock 34 left
More Information on Shipping
  • Buy 50 for $19.50 each and save 2%
  • Buy 100 for $18.99 each and save 5%

Dow Corning®TC-5688 Thermally Conductive Compound was developed exclusively for Intel microprocessors in collaboration with the Intel Mobile Platforms Group. TC-5688 was developed and optimized for multi-chip packages and employs a proprietary formula of advanced silicone polymers that interacts with thermally conductive filler particles to form a matrix that is highly resistant to pump-out and other common failure mechanisms. The result is a thermal compound that delivers extreme performance and exceptional reliability for the thermal interface needs.

*Note: This Item can not be shipped using DHL*

  • Low thermal resistance for superior heat transfer, 0.061cm²C/W @40 PSI
  • Thin bond line for hi-efficiency conductivity
  • Enhance cooling performance
  • Non pressure dependent
  • Multi-language instructions included
  • RoHS compliant
  • AMD recommended
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