Feser H-Bridge CPU / GPU / NB / MOSFET Thermal Compound - 5g
The Feser Company (TFC) is one of the specialists among the manufacturers of water cooling and is expanding its offerings in this area. In the wake of this development is a separate thermal compound in the name of H-Bridge. The layer between the cooler and the heat source should never be forgotten. Both surfaces look flat , but microscopic valleys are always present and thus never 100% contact is impossible to achieve. A thermal compound fills gaps and allows a transfer of heat over the entire surface.
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The layer between the cooler and the heat source should never be forgotten. Both surfaces look flat , but microscopic valleys are always present and thus never 100% contact is impossible to achieve. A thermal compound fills gaps and allows a transfer of heat over the entire surface.
With a thermal conductivity of 9.24 W / m ° C is a remarkable performer. The thermal paste is suitable for all types of coolers suitable: CPU, GPU, Chipset, voltage transformers, etc. The compound is suitable over a temperature range of -30 to +200 ° C guaranteed. With 5g, the amount per tube is plenty for many applications.
*Note: This Item can not be shipped using DHL*
| Thermal Conductivity: | 3.8 W/m-K |
|---|---|
| Thermal Impedence: | 0.087 U2/W |
| Specific Gravity: | 2.5 |
| Dielectric Constant A (100Hz): | 5.1 |
| Viscosity: | No Flowing |
| Thixotropic Index: | 380±10 / 10mm |
| Operation Temp: | -50~240 |
| Silicone Compunds: | 50% |
| Carbon Compounds: | 20% |
| Metal Oxide Compounds: | 30% |
| Content Syringe: | 5g |
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