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Masscool - Fanner-420 White Thermal Grease Resealable Tube

Masscool - Fanner-420 White Thermal Grease Resealable Tube

IC Diamond 7 Carat Thermal Compound - 1.5 gram

IC Diamond 7 Carat Thermal Compound - 1.5 gram

Feser H-Bridge CPU / GPU / NB / MOSFET Thermal Compound - 5g

SKU
FESER-H-BRIDGE-D

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The Feser Company (TFC) is one of the specialists among the manufacturers of water cooling and is expanding its offerings in this area. In the wake of this development is a separate thermal compound in the name of H-Bridge. The layer between the cooler and the heat source should never be forgotten. Both surfaces look flat , but microscopic valleys are always present and thus never 100% contact is impossible to achieve. A thermal compound fills gaps and allows a transfer of heat over the entire surface.

Special Price $2.95 was $11.99
In stock Good Stock 15 left
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The Feser Company (TFC) is one of the specialists among the manufacturers of water cooling and is expanding its offerings in this area. In the wake of this development is a separate thermal compound in the name of H-Bridge.

The layer between the cooler and the heat source should never be forgotten. Both surfaces look flat , but microscopic valleys are always present and thus never 100% contact is impossible to achieve. A thermal compound fills gaps and allows a transfer of heat over the entire surface.

With a thermal conductivity of 9.24 W / m ° C is a remarkable performer. The thermal paste is suitable for all types of coolers suitable: CPU, GPU, Chipset, voltage transformers, etc. The compound is suitable over a temperature range of -30 to +200 ° C guaranteed. With 5g, the amount per tube is plenty for many applications.

*Note: This Item can not be shipped using DHL*

Thermal Conductivity: 3.8 W/m-K
Thermal Impedence: 0.087 U2/W
Specific Gravity: 2.5
Dielectric Constant A (100Hz): 5.1
Viscosity: No Flowing
Thixotropic Index: 380±10 / 10mm
Operation Temp: -50~240
Silicone Compunds: 50%
Carbon Compounds: 20%
Metal Oxide Compounds: 30%
Content Syringe: 5g
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