LM liquid thermal compounf is the latest generation of thermal interfaces. LM compound does not contain non-metallic additives such as silicones or metal oxides. This high purity allows greatly increased thermal transfer compared to standard compounds. LM liquid metal compound is made from 100% liquid metal and is produced in a highly advanced production and developement process made for the highest requirements. Dwarfing all converntional thermal compounds and featuring easy application in combination with a thermal conductivity increased ten-fold over conventional compound, this is the ultimate thermal transfer solution.
LM liquid thermal compound is the latest generation of thermal interfaces. LM compound does not contain non-metallic additives such as silicone's or metal oxides. This high purity allows greatly increased thermal transfer compared to standard compounds.
LM liquid metal compound is made from 100% liquid metal and is produced in a highly advanced production and development process made for the highest requirements. Dwarfing all conventional thermal compounds and featuring easy application in combination with a thermal conductivity increased ten-fold over conventional compound, this is the ultimate thermal transfer solution. A multitude of tests and user reviews have shown that liquid metal thermal compounds leave all conventional thermal compounds (known to us) far behind in the dust.
Important: LM liquid metal thermal compound is not suitable for use on Aluminum surfaces. Comparison (see image gallery): CPU temperatures can be lowered from approx. 50°C to 44°C - an improvement by 6°C!
Extent of delivery: Syringe with dosing top for finest application and cap Gross weight: approx. 3.2g Sufficient for multiple applications
Please note the following points:
LM liquid thermal compound is currently the best thermal interface for electronic components. It can be used on CPU, GPU and other components, providing an improved cooling performance by approx. 3°C to 7°C compared to conventional thermal compounds.
LM compound was developed for high-end cooling applications and must only be applied to contact surfaces such as Copper, Nickel, Silver or Gold. It must not be applied to Aluminum surfaces!
IMPORTANT: LM compound is electrically conductive, hence all contact with conductor paths must be avoided. Being applied to the cooling surface, this conductivity is no hazard, as both contact surface (e.g. heatspreader or DIE) and heatsink themselves are already electrically conductive.
LM compound does not contain Mercury or other toxic heavy metals such as Lead. It is hence not toxic, not flammable, not explosive and does emit vapors. A safety data sheet may be requested via E-Mail.
Despite being liquid, LM compound has a high contact tensions (by adhesive forces) and can not flow from the contact surface when applied properly. It is mandatory that only a very small amount (a small drop) is applied with e.g. a brush, barely covering the surface. If these instructions are being followed, the contact surface (e.g. the CPU) does not need to be sealed, as the LM compound can not flow from the surface even with vertical mounting.
https://www.performance-pcs.com/phobya-liquid-metal-thermal-compound-lm-0-5g-ph-31001-d.html11508Phobya Liquid Metal Thermal Compound LM (0.5g)https://www.performance-pcs.com/media/catalog/product/t/m/tmp31001_01.jpg4.954.9500USDInStock/TIM's Pastes and Pads<p>LM liquid thermal compounf is the latest generation of thermal interfaces. LM compound does not contain non-metallic additives such as silicones or metal oxides. This high purity allows greatly increased thermal transfer compared to standard compounds. LM liquid metal compound is made from 100% liquid metal and is produced in a highly advanced production and developement process made for the highest requirements. Dwarfing all converntional thermal compounds and featuring easy application in combination with a thermal conductivity increased ten-fold over conventional compound, this is the ultimate thermal transfer solution. </p> <div style="font-size: 14px; font-family: tahoma,arial,helvetica,sans-serif;">
<div>
<p><span style="font-size: small;" size="2">LM liquid thermal compound is the latest generation of thermal interfaces. LM compound does not contain non-metallic additives such as silicone's or metal oxides. This high purity allows greatly increased thermal transfer compared to standard compounds.</span></p>
<span style="font-size: small;" size="2"></span>
<p><span style="font-size: small;" size="2">LM liquid metal compound is made from 100% liquid metal and is produced in a highly advanced production and development process made for the highest requirements. Dwarfing all conventional thermal compounds and featuring easy application in combination with a thermal conductivity increased ten-fold over conventional compound, this is the ultimate thermal transfer solution. <br /> A multitude of tests and user reviews have shown that liquid metal thermal compounds leave all conventional thermal compounds (known to us) far behind in the dust.</span></p>
<span style="font-size: small;" size="2"></span>
<p><span style="font-size: small;" size="2"><strong>Important: </strong>LM liquid metal thermal compound is not suitable for use on Aluminum surfaces.<br /></span> <span style="font-size: small;" size="2"><strong>Comparison (see image gallery): </strong>CPU temperatures can be lowered from approx. 50°C to 44°C - an <strong>improvement by 6°C! </strong></span></p>
<span style="font-size: small;" size="2"></span></div>
</div><p><span style="font-family: tahoma,arial,helvetica,sans-serif; font-size: small;" red="" face="tahoma,arial,helvetica,sans-serif" size="2"><strong><span style="font-size: large; color: #ff0000;">*Note: This Item can not be shipped using DHL*</span><br /></strong></span></p>Phobya00https://www.performance-pcs.com/media/catalog/product/t/m/tmp31001_02.jpghttps://www.performance-pcs.com/media/catalog/product/t/m/tmp31001_03.jpghttps://www.performance-pcs.com/media/catalog/product/t/m/tmp31001_04.jpghttps://www.performance-pcs.com/media/catalog/product/t/m/tmp31001_05.jpghttps://www.performance-pcs.com/media/catalog/product/t/m/tmp31001_06.jpg3.8100add-to-cartPhobyaPhase Change Metal Alloy<p><span style="font-size: small;" size="2"><strong>Extent of delivery: </strong><br /> Syringe with dosing top for finest application and cap<br /> Gross weight: approx. 3.2g<br /> Sufficient for multiple applications</span></p>
<p><span style="font-size: small;" size="2"><strong>Please note the following points: </strong></span></p>
<ul>
<li><span style="font-size: small;" size="2">LM liquid thermal compound is currently the best thermal interface for electronic components. It can be used on CPU, GPU and other components, providing an improved cooling performance by approx. 3°C to 7°C compared to conventional thermal compounds.</span></li>
<li><span style="font-size: small;" size="2">LM compound was developed for high-end cooling applications and must only be applied to contact surfaces such as Copper, Nickel, Silver or Gold. It must not be applied to Aluminum surfaces!</span></li>
<li><span style="font-size: small;" size="2"><strong>IMPORTANT: </strong>LM compound is electrically conductive, hence all contact with conductor paths must be avoided. Being applied to the cooling surface, this conductivity is no hazard, as both contact surface (e.g. heatspreader or DIE) and heatsink themselves are already electrically conductive.</span></li>
<li><span style="font-size: small;" size="2">LM compound does not contain Mercury or other toxic heavy metals such as Lead. It is hence not toxic, not flammable, not explosive and does emit vapors. A safety data sheet may be requested via E-Mail.</span></li>
<li><span style="font-size: small;" size="2">Despite being liquid, LM compound has a high contact tensions (by adhesive forces) and can not flow from the contact surface when applied properly. It is mandatory that only a very small amount (a small drop) is applied with e.g. a brush, barely covering the surface. If these instructions are being followed, the contact surface (e.g. the CPU) does not need to be sealed, as the LM compound can not flow from the surface even with vertical mounting.</span></li>
</ul>
/TIM's Pastes and Pads1202TIM's Pastes and Padshttps://www.performance-pcs.com/tim-s-pastes-and-pads.htmlhttps://www.performance-pcs.com/media/catalog/category/TIM_s.jpg12
Good Stock 9 left
Download PDF 
